Alloy e Ncha ea Constantan Flat Wire Copper Nickel 6j11 Ribone 0.4*2mm
Sebopeho | Ho hanyetsa ( 200C μ Ω . m) | Max. Mocheso o sebetsang (0C) | Tensile Strength (Mpa) | Sebaka se qhibilihang (0C) | Boima ba 'mele (g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μ V/ 0C) (0~100 0C) |
Alloy Nomenclature | |||||||
NC003 (CuNi1) | 0.1 | 200 | ≥ 250 | 1095 | 8.9 | <100 | -12 |
Lintho Tsa 'Mele | Metric | Maikutlo |
Botenya | 8.94 g/cc | |
Thepa ea Mechini | Metric | Maikutlo |
Matla a Tensile, a ho qetela | 262 - 531 MPa | |
Matla a Tensile, Kotulo | 276 - 524 MPa | Ho itšetlehile ka bohale |
Elongation at Break | 46.0 % | ka 50.8 mm. |
Modulus ea Elasticity | 115 GPA | |
Poissons karo-karolelano | 0.310 | E baletsweng |
Boikemisetso | 20% | UNS C36000 (koporo e sehang mahala) = 100% |
Shear Modulus | 44.0 GPA | |
Thepa ea Motlakase | Metric | Maikutlo |
Ho hanyetsa Motlakase | 0.0000120 ohm-cm @Mocheso 20.0 ° C | |
Thermal Properties | Metric | Maikutlo |
CTE, e tšoanang | 17.5 µ m/m-° C @Mocheso 20.0 - 300 ° C | |
Bokhoni bo khethehileng ba Mocheso | 0.380 J/g-° C | |
Thermal Conductivity | 64.0 W/mK @Mocheso 20.0 ° C | |
Melting Point | = 1125 ° C | Liquidus |
Liquidus | 1125 ° C | |
Ho sebetsa Thepa | Metric | Maikutlo |
Anealing Mocheso | 565 - 815 ° C | |
Mocheso oa ho sebetsa o chesang | 815 - 950 ° C | |
Karolo Elements Thepa | Metric | Maikutlo |
Koporo, Cu | > = 91.2% | |
Iron, Fe | 1.30 - 1.70% | |
Moetapele, Pb | <= 0.050% | |
Manganese, Mong | 0.30 - 0.80 % | |
Nickel, Na | 4.80 - 6.20 % | |
Zinc, Zn | <= 1.0% |
CuNi44 Chemical Content,%
Ni | Mn | Fe | Si | Cu | Tse ding | Tataiso ea ROHS | |||
Cd | Pb | Hg | Cr | ||||||
44 | 1% | 0.5 | - | Bal | - | ND | ND | ND | ND |
Thepa ea Mechini
Max Continuous Service Temp | 400ºC |
Resisivity ho 20ºC | 0.49±5%ohm mm2/m |
Botenya | 8.9g/cm3 |
Thermal Conductivity | -6(Boholo) |
Melting Point | 1280ºC |
Matla a Tensile,N/mm2 Annealed,Soft | 340 ~ 535 Mpa |
Matla a Tsitsitseng,N/mm3 Cold Rolled | 680 ~ 1070 Mpa |
Elongation(anneal) | 25%(Metsotso) |
Elongation (ho bata ho phuthoa) | ≥Metsotso)2%(Metsotso) |
EMF vs Cu, μV/ºC (0~100ºC) | -43 |
Sebopeho sa Micrographic | austenite |
Thepa ea Magnetic | E seng |