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Poleiti ea Koporo ea CuMn3 Manganin 1.0mm×300mm×1000mm Poleiti ea Alloy e Phahameng ea Conductivity

Tlhaloso e Khutšoanyane:


  • Sehlopha sa motsoako:CuMn3 (bohale bo qhibilihisitsoeng, M)
  • Litekanyo:1.0×300×1000mm (e ka fetoloang)
  • 1.0×300×1000mm (e ka fetoloang):0.18 μΩ·m
  • TCR (0–100℃):±5×10⁻⁶/℃
  • Matla a tšepe:≥280 MPa (e annealed)
  • Ho lelefatsa:≥35%
  • Boima (HB):60–80
  • Botenya:8.90 g/cm³
  • Qaqiso ea Sehlahisoa

    LBH

    Li-tag tsa Sehlahisoa

    Tlhaloso ea Sehlahisoa

    CuMn3Poleiti ea Koporo ea Manganin(1.0×300×1000mm)

    Kakaretso ea Sehlahisoa

    Poleiti ea koporo ea CuMn3 manganin (1.0×300×1000mm) e tsoang ho Tankii Alloy Material ke poleiti ea alloy ea koporo-manganese e nepahetseng haholo e nang le qetello e khanyang le e boreleli ea bokaholimo joalokaha ho bontšitsoe. E entsoe ka Cu (tekanyo) + 2.5–3.5% Mn e nang le likarolo tse tsitsitseng tsa trace, e hlahisoa ka ho qhibilihisa vacuum, ho phutholla ho chesang/ho batang, ho annealing ka nepo le ho bentša bokaholimo. E na le coefficient ea mocheso o tlase haholo (TCR), resistivity e tsitsitseng, le sebopeho se setle haholo, e leng se etsang hore e be e loketseng li-resistor tse nepahetseng, li-shunt tsa hona joale, li-gauge tsa khatello, le likarolo tsa motlakase tse hlokang botsitso ba nako e telele.

    Mekhoa e Tloaelehileng le Motheo oa Lintho tsa Bohlokoa

    • Sehlopha sa Alloy: CuMn3 (e lekanang le UNS C18700, DIN 2.0842, GB/T 2040-2017)
    • Tlhaloso ea Senotlolo: 1.0mm (botenya) × 300mm (bophara) × 1000mm (bolelele); mamello: botenya ± 0.02mm, bophara ± 0.3mm, bolelele ± 2mm
    • Sebopeho sa Lik'hemik'hale (boima%): Mn: 2.5–3.5%; Cu: ho leka-lekana; Fe ≤0.3%; Pb ≤0.05%; C ≤0.1%
    • Maemo a Latelang: ASTM B124, EN 13602, GB/T 2040-2017, RoHS 2.0
    • Moetsi: Tankii Alloy Material, e netefalitsoeng ho ISO 9001 le ISO 14001

    Melemo ea Bohlokoa ea Motheo (E thehiloe holim'a Qetello e Khanyang le Poleiti ea 1.0mm)

    1. Tshebetso ea Motlakase e Tsitsitseng ka ho Fetisisa

    • TCR e Tlase le Ho Ikemela ho Tsitsitseng: Ho Ikemela ho Tsitsitseng = 0.18 μΩ·m (20℃), TCR = ±5×10⁻⁶/℃ (0–100℃), ho netefatsa ho sisinyeha ha khanyetso ≤0.005%/℃—e leng ea bohlokoa bakeng sa ho lekanya ka nepo le lipotoloho tsa taolo.
    • Bokaholimo bo Khanyang le Khanyetso e Tlase ea ho Amana: Qetello e khanyang e bentšitsoeng (Ra ≤0.2μm) e fokotsa khanyetso ea ho amana le ho ntlafatsa bokhoni ba ho kopanya, e leng se loketseng bakeng sa li-shunt le li-resistor blanks.

    2. Thepa e Hloahloa ea Mekaniki le Tsamaiso

    • Bokgoni bo Botle ba ho Sebetsa le ho Bopa: Ho Lelefatsa ≥35% (e annealed), radius e kobehileng ≤1× botenya (180° kobeha ntle le ho petsoha), e tshehetsa ho hata, ho fata le ho seha ka laser.
    • Ho nepahala ho Hoholo ha ho Fapana le ho Tekanyo: Ho Fapana ha ≤0.1mm/m, ho lekana ha botenya ±0.02mm, ho loketse ho koala karolo e nepahetseng ka bongata bo phahameng.

    3. Ho senyehe hantle le ho hanela tikoloho

    • Ho Hanela Tshenyo e Sepakapakeng le e Bobebe: E etsa filimi e teteaneng ya oxide, e feta teko ya ho fafatsa letsoai ya ASTM B117 ya dihora tse 500 ntle le tshenyo e totobetseng.
    • Mocheso o Sephara oa Ts'ebetso: -40℃ ho isa ho 120℃, ts'ebetso e tsitsitseng libakeng tsa indasteri le lisebelisoa tsa elektroniki.

    Litlhaloso tsa Tekheniki

    Tšobotsi Boleng (Bo Tloaelehileng)
    Kereiti ea motsoako CuMn3 (bohale bo qhibilihisitsoeng, M)
    Litekanyo 1.0×300×1000mm (e ka fetoloang)
    Ho hanyetsa (20℃) 0.18 μΩ·m
    TCR (0–100℃) ±5×10⁻⁶/℃
    Matla a tšepe ≥280 MPa (e annealed)
    Ho lelefatsa ≥35%
    Boima (HB) 60–80
    Botenya 8.90 g/cm³
    Qetello ea Bokaholimo E bentšitsoeng ka khanya (Ra ≤0.2μm)
    Mocheso o sebetsang -40℃ ho isa ho 120℃

    Litlhaloso tsa Sehlahisoa

    Ntho Tlhaloso
    Foromo ea Phepelo Poleiti e le 'ngoe/sekotjana (lipoleiti tse 10–50 ka sekotjana)
    Phekolo ea Bokaholimo E bentšitsoeng ka mokhoa o khanyang, e pentiloeng ka asene, kapa e kentsoe ka sekoting sa motlakase (ha ho hlokahale)
    Ho sebetsa habonolo Ho hatakela, ho tjhesa, ho seha ka laser, ho sebetsa ka CNC, ho tjheseletsa matheba
    Sephutheloana Filimi ea PE + lera la foam + lebokose la lehong (le thibelang ho ngoapa le ho fetoha ha sebopeho)
    Ho iketsetsa Botenya (0.5–20mm); bophara (100–1000mm); bolelele (500–3000mm); phetoho ea thatafalo

    Maemo a Tloaelehileng a Kopo

    • Lisebelisoa tse Nepahetseng: Li-resistor tse Nepahetseng, li-shunt tsa hona joale, marokho a Wheatstone bakeng sa li-multimeter le li-analyzer tsa matla.
    • Likarolo tsa Elektroniki: Likheo tsa gauge ea khatello, li-grid tsa khanyetso bakeng sa li-converter tsa maqhubu, lipotoloho tsa puseletso ea mocheso.
    • Taolo ea Liindasteri: Li-module tsa ho lokisa matšoao, likarolo tsa ho hanyetsa ka nepo tsa PLC.
    • Bongaka le Likoloi: Li-resistor tsa lisebelisoa tsa tlhahlobo tse nkehang habobebe, li-shunt tsa sensor ea likoloi.

  • E fetileng:
  • E 'ngoe:

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