Alloy e bonts'a resistivity e tlaase le mocheso o phahameng oa mocheso oa ho hanyetsa. Lisebelisoa tse tloaelehileng li kenyelletsa lisebelisoa tsa motlakase, lisebelisoa tsa nako, lisebelisoa tse thibelang mocheso, lisebelisoa tse lefang mocheso, lisebelisoa tsa motlakase, lithapo tsa ho futhumatsa le lithapo, lisebelisoa tse nepahetseng le tsa vitreous resistors, potentiometers le lisebelisoa tsa ho futhumatsa mocheso o tlaase.
Kereiti | CuNi44 | CuNi23 | CuNi10 | HoNi6 | CuNi2 | CuNi1 | HoNi8 | CuNi14 | HoNi19 | CuNi30 | CuNi34 | CuMn3 | |
Cuprothal | 49 | 30 | 15 | 10 | 5 | ||||||||
Isabellehutte | ITSANE | Motsoako oa 180 | Motsoako oa 90 | Motsoako oa 60 | Motsoako oa 30 | ISA 13 | |||||||
Moqapi ka lebitso% | Ni | 44 | 23 | 10 | 6 | 2 | 1 | 8 | 14 | 19 | 30 | 34 | - |
Cu | Bal | Bal | Bal. | Bal. | Bal. | Bal. | Bal. | Bal. | Bal | Bal | Bal | Bal | |
Mn | 1 | 0.5 | 0.3 | - | - | - | - | 0.5 | 0.5 | 1.0 | 1.0 | 3.0 | |
Mocheso o phahameng oa ho sebetsa(uΩ/m ho 20°C) | 0.49 | 0.3 | 0.15 | 0.10 | 0.05 | 0.03 | 0.12 | 0.20 | 0.25 | 0.35 | 0.4 | 0.12 | |
Resisivity (Ω/cmf ho 68°F) | 295 | 180 | 90 | 60 | 30 | 15 | 72 | 120 | 150 | 210 | 240 | 72 | |
Mocheso o phahameng oa ho sebetsa(°C) | 400 | 300 | 250 | 200 | 200 | 200 | 250 | 300 | 300 | 350 | 350 | 200 | |
Boima ba 'mele(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
TCR(×10-6/°C) | <-6 | <16 | <50 | <60 | <120 | <100 | <57 | <30 | <25 | <10 | <0 | <38 | |
Tensile Strength(Mpa) | ≥420 | ≥350 | ≥290 | ≥250 | ≥220 | ≥210 | ≥270 | ≥310 | ≥340 | ≥400 | ≥400 | ≥290 | |
Elongation(%) | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | |
EMF vs Cu UV/°C(0~100°C) | -43 | -34 | -25 | -12 | -12 | -8 | 22 | -28 | -32 | -37 | -39 | - | |
Melting Point (°C) | 1280 | 1150 | 1100 | 1095 | 1090 | 1085 | 1097 | 1115 | 1135 | 1170 | 1180 | 1050 | |
Thepa ea Magnetic | eseng | eseng | eseng | eseng | eseng | eseng | eseng | eseng | eseng | eseng | eseng | eseng |