Sekotwana sa motsoako wa manganin sa 6J13 (0.19mm×25mm), sehlahiswa sa motsoako wa ho hanyetsa ka nepo se tswang ho Tankii Alloy Material, ke sekotwana se sebetsang sa thin-gauge se entsweng ka motsoako wa manganin wa Mn-Cu-Ni ternary. Ka ho qhibilihisa ka vacuum step, ho pitikisa ka mokhoa o batang ka ho fetisisa, le ditshebetso tsa ho annealing tse arohaneng, sekotwana sena se fihlella taolo e tiileng haholo (botenya ba 0.19mm ±0.002mm, bophara ba 25mm ±0.1mm) le thepa e tsitsitseng ya motlakase.

• Sehlopha sa Motsoako: 6J13 (motsoako o tloaelehileng oa China oa ho hanyetsa manganin ka nepo; o ntlafalitsoe bakeng sa ts'ebetso ea ho phutholla e tšesaane)
• Tlhaloso ea Tekanyo: Botenya ba 0.19mm × bophara ba 25mm (e ka fetoloa, empa 规格 ena e tsitsitseng e ts'oana le li-dies tse tloaelehileng tsa ho hatakela likarolo tse nyane)
• Ho Lokisa Machaba: Tshebetso e tsamaellanang le DIN 17471 CuMn12Ni2 strips tse tshesane, tse nang le dikahare tsa Mn tse lokisitsweng (12.0-13.0%) ho ntlafatsa ho ductility e tshesane ya gauge
• Maemo a Latelang: GB/T 1234-2019 (meqomo ea alloy ea khanyetso) + GB/T 2059-2021 (meqomo ea alloy ea koporo) + IEC 60404-8-2 (likarolo tse hanyetsanang hantle)
• Moetsi: Tankii Alloy Material, e netefalitsoeng ho ISO 9001 le RoHS, e nang le mela e ikhethileng ea ho phutholla alloy e tšesaane (botenya ba ho phutholla bonyane ke 0.01mm)

• Ho nepahala ha Botenya bakeng sa Miniaturization: Botenya ba 0.19mm bo fihla "tekanyong ea khauta" bakeng sa lisebelisoa tse nyane - tse tšesaane ho feta li-strips tsa 0.25mm (ho fokotsa bophahamo ba likarolo ka 24%) ha ho ntse ho qoba ho robeha ha li-strips tse tšesaane haholo (<0.15mm) tse petsohang nakong ea ho hata.
• Bophara bo Bonyenyane bakeng sa ho Stamping ka Sehlopha: Bophara ba 25mm bo lekana le disete tse 4-6 tsa di-micro-shunt stamping dies (boholo ba die ka nngwe ~4mm) ka strip, e leng se nolofalletsang ho hata hanngoe ha dikarolo tse 2000+ tse nyane ka strip ya 100m - ho fokotsa matlakala a thepa ka 30% ha ho bapiswa le ho sebedisa di-strips tse bophara ba 50mm bakeng sa dikarolo tse nyane.

• Ho Kgomarela ho Hloahloa ka Botebo bo Hodimo: Sebopeho se senyenyane sa strip (boholo ba koro ≤20μm) le bokaholimo bo kganyang bo annealed (Ra ≤0.15μm) di tshehetsa ho kgomarela ha dikhemikhale ho hoholo–bophara ba mola o bonyane bo annealed ho fihlela ho 0.02mm.
• Ho Tiea ka ho Tenyetseha ha Setempe: Kamora makhetlo a 5000 a ho hatakela ho sa khaotseng (ho etsisa tlhahiso ea bongata), phapang ea botenya ba seporo ke <0.001mm, 'me ho kheloha ha khanyetso ea likarolo tse hataketsoeng ke ≤0.05%.

• Moralo o Bolokang Thepa: Bophara bo moqotetsane ba 25mm bo tsitsitseng bo felisa ho petsoha ha bobeli (mohato o tloaelehileng bakeng sa mela e sephara), bo fokotsa litšenyehelo tsa ts'ebetso ka 18% le ho khutsufatsa lipotoloho tsa ho tlisa ka matsatsi a 3-5.
• Boikhethelo ba Tempere e 'Meli: E fana ka temperere e bonolo (e annealed, e leng bolelele ba ≥25%) le e thata ka halofo (e leng bolelele ba 15-20%) bakeng sa lits'ebetso tse fapaneng.

• Ho tjhaja ka potlako ha di-elektroniki tsa bareki: Di-shunt tsa motlakase o monyenyane bakeng sa ditjhaja tsa di-smartphone tsa 65W (botenya ba 0.19mm bo lekana le moralo o mosesaane wa tjhaja, bophara ba 25mm bo tshehetsa ho hatakelwa ha di-shunt tse 4 ka strip).
• Li-Sensor tsa Bophelo bo Aperehang: Lintho tse hanyetsanang bakeng sa li-sensor tse bohlale tsa lebelo la pelo (mocheso o bonolo o nolofalletsa ho kobeha ha radius ea 0.38mm, bophara bo bokhutšoanyane ba 25mm bo fokotsa litšila tsa thepa).
• Li-Node tsa Sensor tsa IoT: Marangrang a micro-resistor bakeng sa li-sensor tsa mocheso/mongobo tse se nang mohala (ho tenyetseha ho feteletseng ho tšehetsa bophara ba mola oa 0.02mm).
• Di-Micro-Electronics tsa Dikoloi: Di-strips tse lemohang hajwale bakeng sa di-module tsa ho tjhaja USB ka koloing (mocheso o thata o tiisa ho nepahala ha di-contact points).

Tankii Alloy Material e kenya tshebetsong "taolo ya boleng bo nepahetseng bo bonyenyane" bakeng sa di-strips tsa 6J13 (0.19×25mm): moqolo o mong le o mong o feta tekanyong ya botenya ba laser (dintlha tse 100 tsa disampole/m), tlhahlobo ya ho batalatsa bokahodimo (ka karolo ya 5m), le teko ya ho etsisa micro-stamping (disampole tse 100 ka sehlopha). Disampole tsa mahala (100mm×25mm, boikgethelo ba mocheso o bonolo/halofo ya boima) le ditlaleho tsa teko ya micro-etching di a fumaneha ha ho kopuwa.