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Tankii 1.0mm Tinned Copper Wire T2 Red Copper Anti-Oxidation & Excellent Conductivity
Tlhaloso ea Sehlahisoa
1.0mm Mohala oa Koporo o Tinngoeng (Kore e Khubelu e Hloekileng ea Koporo, 3-5μ Mohatla oa Tin)
Tlhaloso ea Sehlahisoa
E le mokhanni oa motlakase ea ts'eptjoang haholo ho tloha Tankii Alloy Material, the1.0mm terata ea koporo e tintsoenge kopanya melemo e 'meli ea mantlha: conductivity e phahameng haholo ea koporo e khubelu e hloekileng (sehlopha sa T2) le tšireletso e khahlanong le ho bola ha lesela le nepahetseng la 3-5μ tin. E entsoe ka ts'ebetso ea Huona e tsoetseng pele e tsoelang pele ea ho qoelisa hot-dip - e nang le tlhahlobo ea nako ea 'nete le taolo ea mocheso - terata e tiisa hore lesela le khomarela ka mokhoa o ts'oanang ho 1.0mm e tiileng ea koporo, ha e na likoting kapa matheba a masesaane. E rarolla lintlha tse peli tse bohloko tsa terata e se nang letho ea koporo: ho fokotseha ha conductivity e bakoang ke oxidation le ho fokola ha solderability, ho etsa hore e be setsi sa likhokahano tsa motlakase tse hlokang botsitso ba nako e telele, kopano e bonolo, le ho hanyetsa maemo a mongobo / a indasteri.
Setifikeiti se Tloaelehileng le Lintho
- Mophato wa Mokhanni: T2 koporo e khubelu e hloekileng (e lumellana le GB/T 3956-2008; e lekanang le ASTM B33, IEC 60288 Sehlopha sa 1)
- Tin Coating Standard: GB/T 4910-2009, IEC 60317-2 (e sa etelle pele: Pb ≤0.005%, Sn ≥99.9%)
- Litifikeiti tsa boleng: RoHS 2.0 e lumellana, sistimi ea taolo ea boleng ea ISO 9001, tumello ea tlhahlobo ea tikoloho ea SGS
- Moetsi: Tankii Alloy Material (lilemo tse 15+ tsa boiphihlelo ba koporo ea koporo)
Melemo ea Ts'ebetso ea Konokono
1. Mokhanni o Hloekileng oa Koporo e Khubelu: Boitšoaro bo sa Tšoaneng
- Motlakase Conductivity: ≥98% IACS (20℃), e fetang hōle koporo e kopantsoeng (mohlala, li-alloys tsa CuNi: ~ 20% IACS) le aluminium (61% IACS). E netefatsa ho theoha ho fokolang ha motlakase ho li-circuits tsa "voltage" tse tlase (mohlala, lithapo tsa likoloi tsa 12V, lithapo tsa USB tsa 5V) le phetiso ea mats'oao ka potlako bakeng sa li-sensor.
- Mechanical Ductility: Elongation ≥30% (25℃) le matla a tensile ≥200 MPa. E khona ho mamella ho kobeha khafetsa (teko ea 180 ° bend ≥10 linako tse ling ntle le ho robeha) bakeng sa likhoele sebakeng se thata (mohlala, likarolo tsa kahare tsa lisebelisoa, likhokahano tsa PCB).
2. 3-5μ Precision Tin Coating: Tšireletso e Lebisitsoeng
- Thibelo ea Anti-Oxidation: Dense tin layer e thibela moea / mongobo hore o se ke oa kopana le koporo, o thibela ho thehoa ha conductive copper oxide (CuO/Cu₂O). Esita le ka mongobo oa 80% bakeng sa likhoeli tsa 12, mohala o boloka ≥97% conductivity ea pele (ha e bapisoa le koporo e se nang letho: e theohela ho 85% likhoeling tsa 3).
- Solderability e ntlafalitsoeng: Sebaka se tlase sa ho qhibiliha ha Tin (232 ℃) se nolofalletsa "ho koloba hang-hang" nakong ea soldering - ha ho hlokahale ho hloekisa pele kapa ho kenya tšebetsong flux. E fokotsa nako ea kopano ea PCB ka 40% vs. koporo e se nang letho (e hlokang ho tlosoa ha oxide ka sanding / lik'hemik'hale).
- Moqapi o leka-lekaneng oa Botenya: Botenya ba 3-5μ bo qoba mekhoa e 'meli e feteletseng: liphahlo tse tšesaane (<3μ) ha li khone ho koahela liphoso tsa koporo, ha liphahlo tse teteaneng (> 5μ) li etsa hore terata e be brittle (e atisang ho phunyeha nakong ea ho kobeha).
Litlhaloso tsa Tekheniki
| Paramethara | Boleng bo qaqileng |
| Nominal Diameter (Kakaretso) | 1.0mm (mokhanni: ~0.992-0.994mm; lesela la thini: 3-5μ) |
| Mamello ea Diameter | ± 0.02 limilimithara |
| Botenya ba ho Koaela Tin | 3μ (bonyane) - 5μ (boholo); ho lekana ha botenya: ≥95% (ha ho letheba <2.5μ) |
| Khokahano ea Motlakase (20℃) | ≥98% IACS |
| Matla a tšepe | 200-250 MPa |
| Elongation at Break | ≥30% (L0=200mm) |
| Thin Adhesion | Ha ho peeling/flaking kamora 180° kobeha (radius=5mm) + teko ea theipi (tepi ea 3M 610, ha ho na masala a thini) |
| Khanyetso ea Corrosion | E fetisa tlhahlobo ea sefafatsi sa letsoai sa ASTM B117 (48h, 5% NaCl, 35 ℃) - ha ho na mafome a khubelu, ho phatloha ha tin |
| Sebaka sa Mocheso oa Ts'ebetso | -40 ℃ (ho feto-fetoha ha mocheso o tlase, ha ho ho phunyeha) ho 105 ℃ (tšebeliso e tsoelang pele, ha ho na thini e qhibilihang) |
Phepelo ea Sehlahisoa & Ho Itloaetsa
| Ntho | Tlhaloso |
| Foromo ea Phepelo | Mokhanni ea tiileng (ea tloaelehileng); mokhanni ea likhoka (tloaelo: 7/0.43mm, 19/0.26mm) |
| Tlhophiso ea Spool | 500m/1000m ka spool (thepa ea spool: polasetiki ea ABS, bophara: 200mm, lesoba la mantlha: 50mm) |
| Surface Finish | thini e khanyang (ka ho feletseng); matte tin (tloaelo, bakeng sa lisebelisoa tse thibelang mahlaseli a kotsi) |
| Liphekolo Tse Eketsehileng | Ho ikhethela ho kenya letsoho (PVC/XLPE/Silicone, botenya: 0.1-0.3mm, 'mala: o motšo / o mofubelu / o moputsoa) |
| Sephutheloana | Mokotla oa foil o tiisitsoeng ka vacuum (bopaki ba mongobo) + lebokose la ka ntle (le nang le desiccant, anti-impact) |
Maemo a Tloaelehileng a Kopo
- Lisebelisoa tsa ka Lapeng: Mehala ea ka hare bakeng sa mechine ea ho hlatsoa (e hana mongobo), lihatsetsi (ho fetoha ha maemo a tlaase), le lionto tsa microwave (ho hanyetsa mocheso ho fihlela ho 105 ℃).
- Likoloi tsa Elektronike: Li-terminals tsa li-connector tsa libeteri tsa koloi (anti-corrosion), li-sensor wiring (letšoao le tsitsitseng), le lisebelisoa tsa infotainment ka koloing (ho theoha ha motlakase o tlase).
- PCB & Consumer Electronics: Ho soasoa ka lesoba bakeng sa liboto tsa Arduino/Raspberry Pi, li-conductors tsa cable tsa USB-C, le wiring ea LED strip (kopano e bonolo).
- Taolo ea Liindasteri: Wiring bakeng sa liphanele tsa PLC (ho hanyetsa mongobo oa indasteri) le lisebelisoa tsa matla a tlaase (tahlehelo e fokolang ea matla).
- Lisebelisoa tsa Bongaka: Mehala ea ka hare bakeng sa lisebelisoa tse nkehang tsa ho hlahloba (tse se nang loto, tse lumellanang le litekanyetso tsa biocompatibility) le lipompo tse nyenyane tsa bongaka (ho kobeha ha maemo).
Tiisetso ea Boleng e tsoang ho Tankii Alloy Material
Sehlopha se seng le se seng sa1.0mm terata ea koporo e tintsoenge etsa litlhahlobo tse tharo tsa bohlokoa:
- Teko ea Botenya ba Tin: X-ray fluorescence (XRF) analyzer (ho nepahala: ± 0.1μ) - 5 lintlha tsa sampole ka spool.
- Teko ea ho khanna: Teko ea lipatlisiso tsa lintlha tse 'nè (ho nepahala: ± 0.5% IACS) - lisampole tse 3 ka sehlopha.
- Teko ea Mechini: Mochini oa tlhahlobo ea bokahohleng (tensile / elongation) + bend tester (adhesion) - 2 sampuli ka sehlopha.
Mehlala ea mahala (bolelele ba 1m, likotoana tse 2-3 ho latela tlhaloso) le Litlaleho tse qaqileng tsa Tlhahlobo ea Material (MTR) li fumaneha ha u kopa. Sehlopha sa rona sa tekheniki se fana ka ts'ehetso ea 1-on-1 bakeng sa litlhoko tsa tloaelo (mohlala, khetho ea thepa ea ho kenya mocheso bakeng sa lisebelisoa tse phahameng tsa mocheso, moralo oa conductor o thata bakeng sa lithapo tse feto-fetohang).
Ngola molaetsa wa hao mona mme o re romele wona
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Judy
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