Tlhaloso ea Sehlahisoa

Sekotwana sa Bimetallic sa TM-1 (Botenya ba 0.1mm × Bophara ba 100mm)

Kakaretso ea Sehlahisoa

Litlhophiso tse Tloaelehileng le Sebopeho sa Motheo

• Sehlahisoa sa Sehlopha: TM-1 (sehlahisoa se ikhethileng sa bimetallic, se etselitsoeng karabelo e bobebe ea mocheso)
• Tlhaloso ea Tekanyo: Botenya ba 0.1mm (mamello: ± 0.003mm) × bophara ba 100mm (mamello: ± 0.15mm)
• Sebopeho sa Motswako: Hangata se na le lera le atolohang haholo (mohlala, motsoako oa Cu-Mn-Zn, α≈20×10⁻⁶/℃) le lera le atolohang hanyane (mohlala, motsoako oa Fe-Ni 36, α≈1.6×10⁻⁶/℃), le nang le matla a ho kuta a interfacial ≥145 MPa (e lekiloeng ka GB/T 14985)
• Maemo a Latelang Melao: E latela GB/T 14985-2017 (Maemo a Sechaena bakeng saleqhetsoana la bimetallics) le IEC 60694 bakeng sa likarolo tsa taolo ea mocheso
• Moetsi: Tankii Alloy Material, e netefalitsoeng ho ISO 9001 le ISO 14001, e nang le bokhoni ba ho phutholla le ho seha ka nepo ka tlung.

Melemo ea Bohlokoa (khahlanong le Li-Strip tsa Bimetallic tse Tloaelehileng le tse Thick-Gauge)

1. Ho nepahala ho hoholo ha 0.1mm (30% e tshesane ho feta di-strips tse tlwaelehileng tsa 0.15mm) ho nolofalletsa ho kopanngwa le disebediswa tse nyane (mohlala, di-sensor tse aparwang, di-circuit breaker tse nyane) ha ka nako e le nngwe ho boloka botenya bo tshwanang (± 0.003mm) ho qoba ho fetofetoha ha mocheso ho sa lekanang.
2. Kutloisiso e Ntlafalitsoeng ea Thermal: Karolelano e phahameng ea coefficient ea katoloso (~12.5:1) e fana ka kobeho e bakoang ke mocheso ea 12-15 m⁻¹ (ho 100℃ khahlano le 25℃)—20% e phahame ho feta li-strips tse teteaneng (0.3mm+), e netefatsang ts'ebetso e potlakileng lisebelisoa tse nang le matla a tlase.
3. Bophara bo Boholo bakeng sa Ts'ebetso ea Lihlopha: Bophara bo tloaelehileng ba 100mm bo lumellana le boholo ba liphanele tsa ho hatakela tsa indasteri, bo lumellang tlhahiso e le 'ngoe ea likaroloana tse 50+ tse nyane (mohlala, likhokahano tsa thermostat) ka strip - e fokotsa nako ea ts'ebetso ka 40% khahlano le strip tse bophara bo moqotetsane.
4. Ho Kopana ho Matla ha Sefahleho: Theknoloji ea ho kopanya thepa e felisa ho arohana ha likarolo esita le ka mor'a potoloho ea mocheso ea 8,000 (-40℃ ho isa ho 180℃) - ho rarolla bothata bo tloaelehileng ba hore li-bimetallic tse nyane (≤0.1mm) li sekametse ho arohana ka lera.
5. Ho kgona ho sebetsa ka bokgabane: Tekanyo e tshesane haholo e thusa ho seha ka laser hore e be dibopeho tse rarahaneng tse nyane (boholo ba sebopeho: 0.5mm) le ho kobeha ka thata (radius ≥1× botenya) ntle le ho petsoha—e leng sa bohlokwa bakeng sa kopano e iketsahallang ya disebediswa tse nyane.

Litlhaloso tsa Tekheniki

Litlhaloso tsa Sehlahisoa

Likopo tse Tloaelehileng

• Micro-Thermostat: Taolo ea mocheso lisebelisoa tse aparoang (mohlala, lioache tse bohlale), li-cooler tsa insulin ea bongaka, le litsamaiso tsa HVAC tse nyane (botenya ba 0.1mm bo lekana le meralo e mesesaane).
• Tšireletso ea ho Chesa ka ho Feteletseng: Li-circuit breaker bakeng sa libeteri tsa lithium-ion (mohlala, libeteri tsa drone, li-earbud tse se nang mohala) le li-micro-motor (ho sebetsa ka potlako ho thibela ho baleha ha mocheso).
• Ho Senseha Sebaka se Seholo: Methapo ea ho hlahloba mocheso bakeng sa mapolanka a PCB (bophara ba 100mm bo koahela likarolo tse ngata) le lisebelisoa tsa elektroniki tse tenyetsehang (karabelo ea mocheso o tšoanang ho pholletsa le mothapo).
• Lisebelisoa tsa Elektroniki tsa Bareki: Lisebelisoa tsa ho futhumatsa bakeng sa lisinki tsa mocheso tsa laptop, litsamaiso tsa fuser tsa printa, le li-module tsa tšireletso ea betri ea li-smartphone.
• Disebediswa tse Nyenyane tsa Diindasteri: Di-shim tse lefellang mocheso bakeng sa di-sensor tsa MEMS (mohlala, di-sensor tsa kgatello dikoloing tse ikemetseng) le di-switch tse nyane tsa mocheso bakeng sa disebediswa tsa IoT.