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Ultra – Tšesaane ka Hare – Stock CuNi44 Foil 0.0125mm Botenya x 102mm Bophara ba Ho Sebetsa ka Botlalo le ho Hanela ho Silafala
Tlhaloso ea Sehlahisoa
Foil ea CuNi44 (Botenya ba 0.0125mm × Bophara ba 102mm)
Kakaretso ea Sehlahisoa
Foile ea CuNi44(0.0125mm × 102mm), motsoako ona oa ho hanyetsa koporo-nickel, o tsejoang hape e le constantan, o khetholloa ka ho hanyetsa motlakase ho phahameng.
hammoho le coefficient e nyane haholo ea mocheso oa khanyetso. Motsoako ona o boetse o bontša matla a phahameng a ho tsitlella
le ho hanyetsa ho bola. E ka sebediswa mochesong o fihlang ho 600°C moyeng.
hammoho le coefficient e nyane haholo ea mocheso oa khanyetso. Motsoako ona o boetse o bontša matla a phahameng a ho tsitlella
le ho hanyetsa ho bola. E ka sebediswa mochesong o fihlang ho 600°C moyeng.
Litlhophiso tse Tloaelehileng
- Sehlopha sa Alloy: CuNi44 (Koporo-Nikele 44)
- Nomoro ea UNS: C71500
- Maemo a Machaba: E latela DIN 17664, ASTM B122, le GB/T 2059
- Tlhaloso ea Tekanyo: Botenya ba 0.0125mm × bophara ba 102mm
- Moetsi: Tankii Alloy Material, e netefalitsoeng ho ISO 9001 bakeng sa ts'ebetso e nepahetseng ea alloy
Melemo ea Bohlokoa (khahlanong le Li-Foil tsa CuNi44 tse Tloaelehileng)
Sena ke 0.0125mm × 102mmFoile ea CuNi44e ikhetha ka moralo oa eona o reretsoeng ho ba mosesaane haholo le o bophara bo tsitsitseng:
- Ho nepahala ho hoholo ha thepa: Botenya ba 0.0125mm (bo lekanang le 12.5μm) bo fihlella bosesane bo etellang pele indastering, bo nolofalletsang ho fokotsoa ha likarolo tsa elektroniki ntle le ho tela matla a mechini.
- Tshebetso e Tsitsitseng ya Khanyetso: Ho hanyetsa ha 49 ± 2 μΩ·cm ho 20°C le coefficient e tlase ya khanyetso ya mocheso (TCR: ±40 ppm/°C, -50°C ho isa ho 150°C)—e netefatsa ho sisinyeha ho fokolang ha khanyetso maemong a tekanyo e nepahetseng haholo, e sebetsa ho feta difoile tse tshesane tse seng tsa alloy.
- Taolo e Tiileng ea Litekanyo: Ho mamella botenya ba ±0.0005mm le mamello ea bophara ba ±0.1mm (bophara bo tsitsitseng ba 102mm) ho felisa litšila tsa thepa meleng ea tlhahiso e iketsang, ho fokotsa litšenyehelo tsa kamora ts'ebetso bakeng sa bareki.
- Sebopeho se Setle ka ho Fetisisa: Ho ductility e phahameng (ho lelefatsa ≥25% boemong ba ho annealed) ho dumella ho rarahana ha micro-stamping le ho fata (mohlala, digridi tse nyane tsa resistor) ntle le ho petsoha—e leng sa bohlokwa bakeng sa tlhahiso e nepahetseng ya elektroniki.
- Ho Hanela Tshenyo: E feta teko ya ho fafatsa letsoai ya ASTM B117 ya dihora tse 500 ka oxidation e fokolang, e netefatsang ho tshepahala ha nako e telele dibakeng tse mongobo kapa tse bobebe tsa dikhemikhale.
Litlhaloso tsa Tekheniki
| Tšobotsi | Boleng |
|---|---|
| Sebopeho sa Lik'hemik'hale (boima%) | Ni: 43 - 45 % Cu: ho leka-lekana Mn: ≤1.2 % |
| Botenya | 0.0125mm (mamello: ± 0.0005mm) |
| Bophara | 102mm (mamello: ± 0.1mm) |
| Bohale | Annealed (e bonolo, bakeng sa ts'ebetso e bonolo) |
| Matla a tšepe | 450-500 MPa |
| Ho lelefatsa (25°C) | ≥25% |
| Boima (HV) | 120-140 |
| Ho hanyetsa (20°C) | 49 ± 2 μΩ·cm |
| Bokgoni ba Bokaholimo (Ra) | ≤0.1μm (qetello e khanyang e annealed) |
| Mefuta ea Mocheso o Buuoang | -50°C ho isa ho 300°C (tšebeliso e tsoelang pele) |
Litlhaloso tsa Sehlahisoa
| Ntho | Tlhaloso |
|---|---|
| Qetello ea Bokaholimo | E benyang e nang le annealed (e se nang oxide, ha e na masalla a oli) |
| Foromo ea Phepelo | Meqolo e tswelang pele (bolelele: 50m-300m, hodima di-spool tsa polasetiki tsa 150mm) |
| Bophara | ≤0.03mm/m (ea bohlokoa bakeng sa ho hlaba ka mokhoa o ts'oanang) |
| Ho khona ho thothomela | E lumellana le mekhoa e tloaelehileng ea ho hlaba acid (mohlala, litharollo tsa ferric chloride) |
| Sephutheloana | E koetsoe ka vacuum ka har'a mekotla ea foil ea aluminium e thibelang oxidation e nang le lintho tse ntšang metsi; lebokose la kantle le nang le foam e monyang tšisinyeho |
| Ho iketsetsa | Seaparo se sa hlokeng ho taboha; maqephe a sehiloeng ho isa boleleleng (bonyane 1m); bolelele ba meqolo bo lokisitsoeng bakeng sa mela e iketsang |
Likopo tse Tloaelehileng
- Di-Micro-Electronics: Di-resistor tsa filimi e tshesane, di-shunt tsa hajwale, le dikarolo tsa potentiometer disebedisweng tse aparwang, di-smartphone le di-sensor tsa IoT (botenya ba 0.0125mm bo nolofalletsa moralo o monyane wa PCB).
- Di-Gauge tsa Kgatelelo: Di-grid tsa tekanyo ya kgatelelo tse nepahetseng haholo (bophara ba 102mm bo lekana diphanele tsa tlhahiso ya tekanyo e tlwaelehileng) bakeng sa disele tsa mojaro le tlhokomelo ya kgatelelo ya sebopeho.
- Lisebelisoa tsa Bongaka: Likaroloana tse nyane tsa ho futhumatsa le likarolo tsa sensor ka har'a lisebelisoa tse ka kenngoang le lisebelisoa tse nkehang habobebe tsa tlhahlobo (ho hanyetsa ts'enyeho ho netefatsa hore e lumellana le maro a 'mele).
- Lisebelisoa tsa Sefofane: Likarolo tsa ho hanyetsa ka nepo li-avionics (ts'ebetso e tsitsitseng tlas'a ho feto-fetoha ha mocheso libakeng tse phahameng).
- Di-elektroniki tse feto-fetohang: Mealo e tsamaisang motlakase ka har'a li-PCB tse tenyetsehang le lipontšo tse ka menoang (boiketsetso bo tšehetsa ho kobeha khafetsa).
Tankii Alloy Material e kenya tshebetsong taolo e matla ya boleng bakeng sa foil ena e tshesane haholo ya CuNi44: sehlopha se seng le se seng se feta tekanyong ya botenya (ka laser micrometer), tlhahlobo ya sebopeho sa dikhemikhale (XRF), le teko ya botsitso ba kganyetso. Disampole tsa mahala (100mm × 102mm) le ditlaleho tse qaqileng tsa teko ya thepa (MTR) di a fumaneha ha di kopuwa. Sehlopha sa rona sa botekgeniki se fana ka tshehetso e ikgethileng—ho kenyeletswa le dikgothaletso tsa diparamente tsa ho betla le ditataiso tsa polokelo ya ho thibela oxidation—ho thusa bareki ho eketsa tshebetso ya foil ena e nepahetseng maemong a tlhahiso e nyane.
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